Here is the information you'll need to do this correctly and properly with NO PROBLEMS.
For "J" lead packages use a braid of solder all the way around the package, plenty of flux and a square head iron set to 600 degrees. Setting it any high and you'll ruin the board because 63/37 solder menlts at 387 degrees.
The large heater irons with the large heads on them DO work properly when you use NO CLEAN flux and braid the entire line of pins on the chip with solder.
After braiding, WARM the chip up with the iron about 1 inch away from it. This prevents shock to the board surface. Then you can remove it.
For GULL WING and SOIC; do not cut the pins, or pull them up. You'll weaken the structures. Use a large diameter solder braid over all the pins and then either a large head iron or a hot air tool (shield the caps and resistors nearby). Remove it by displacing it, not PULLING it upwards, sideways only!!!
Reflowing is done with a minitip and a lot of flux, never touch the pads or the pins, let the ball of solder carry the load of the work for you, and presto - instantly beautiful connections. Always use a large magnification eyepiece and make doubly sure you're grounded and that the temperature of the circuitry is kept at 50 centigrade.
Electronic Circuit Repair & Technology Center www.electech.com.
